TGL-W-SI

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TGL-W-SI Silikon Gap Filler Putty dispensierbar

TGL-W-SI is an electrically insulating thermally conductive, highly viscuous dispensable form-in-place gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The ready-made compound does not require an additional crosslinking process. Due to the specific formulation and filling with ceramic particles the material has a very high thermal conductivity. After dispensing the viscoplastic material leads to an optimum thermal contact at no pressure. By its use the total thermal resistance is minimised.




PROPRIÉTÉS

  • Dispensable
  • Almost zero pressure at assembly due to viscoplasticity
  • Thermal conductivity: 3.3 W/mK (ASTM D 5470) / 5.5 W/mK (Intern method)
  • Ready-made, no additional crosslinking required

DISPONIBILITÉ

  • Pail 2 kg
  • Others on request

EXEMPLES D'APPLICATION

Thermal link of:

  • SMD packages
  • Through-hole vias
  • RDRAMs memory modules
  • Flip Chips, DSPs, BGAs, PPGAs

For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs

OVERVIEW

PropertyUnitTGL-W-SI
MaterialKeramik gefüllter Silikoncompound
ColourGrey
Densityg/cm³3,1
Viscosity (@ 10 1/min, 25 °C)Pas500
Penetrationmm/10290
RoHS Conformity2015 / 863 / EUYes
Thermal
Thermal Conductivity (ASTM D 5470)W/mK3.3
Thermal Conductivity (Intern method)W/mK5.5
Operating Temperature Range°C- 40 bis + 130
Electric
Dielectric StrengthkV / mm7
Volume ResistivityOhm - cm1,1 x 1014