2K SILIKON GAP-FILLER TDG-Z8-SI-2C

dispensable / 2-component/ low volatile siloxanes (LV) / form-in-place
2K Silikon Gap-Filler TDG-Z8-SI-2C – Hochleitfähiges 2K-Silikonmaterial (8,0 W/mK) in Blau-Weiß, ideal für thermische Anforderungen in Elektronikbaugruppen.

TDG-Z8-SI-2C is a 2-part dispensable low volatile LV silicone gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at noncoplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact. Due to its negligible and controlled volatile content it is suited for environments where volatile silicones are critical.

PROPRIÉTÉS
  • Dispensable 2-part silicone
  • Low volatile siloxane content (LV)
  • Thermal conductivity: 8.0 W/mK
  • Remains elastic after polymerisation
  • Zero stress on components
  • Heat accelerated curing
  • Shock absorbing
DISPONIBILITÉ
  • Cartridges 2 x 25 ml / 2 x 200 ml / 2 x 600 ml
  • Pail 2 x 25 kg
EXEMPLES D'APPLICATION

Thermal link of:

  • FPBGA
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs

OVERVIEW
PropertyUnitA-KomponenteB-Komponente
ColourBlueWhite
Density @ 25 °Cg/cm³3,253,25
Mixing RatioWeight or Volume1 : 11 : 1
HardnessShore 006565
ViscosityPas200180
Viscosity (mixed)Pas190190
Pot Life @ 25 °C and 65 % RH (Time for viscosity to double)Minutes40 – 9040 – 90
Curing Time @ 25 °C / 80 °CHours / Minutes10 ±2 / 30 ±1010 ±2 / 30 ±10
Shelf Life (from Date of Manu- facturing, unopened, dry storage conditions @ –15 – 35 °C) Months66
Flammability (Equivalent)UL 94V0V0
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal ConductivityW/mK88
Operating Temperature°C- 40 bis + 150- 40 bis + 150
Dielectric StrengthkV/mm≥ 8≥ 8
Volume ResistivityOhm-cm≥ 1 x 1012≥ 1 x 1012

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