TEL-R-SI is a low dielectric, high performance thermally conductive LV silicone gap filler for an optimised thermal coupling between electronic packages and heat sinks even over large gaps or big tolerances.Through the specific formulation and filling with highly thermally conductive particles an extraordinary high anisotropic thermal conductivity is reached. Its conformal surface structure and extreme softness guarantee a very good compliance to the contact surfaces at very low pressure. Thus the total thermal resistance is minimised. The elastomer shows a low dielectric strength.