TEL-Z-SI

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TEL-Z-SI Silikon Gap Filler hoch thermisch leitfähig

TEL-Z-SI is a non dielectric high performance thermally conductive LV silicone foil for an optimised thermal coupling between electronic packages and heat sinks even over large gaps or big tolerances.Through the specific formulation and filling an extraordinary high anisotropic thermal conductivity is reached. Its conformal surface structure and high softness guarantee a very good compliance to the contact surfaces at low pressure. Thus the total thermal resistance is minimised.



PROPRIÉTÉS

  • High surface compliance and softness
  • Low volatile siloxane content (LV)
  • Non dielectric
  • No paint wetting impairment
  • Thermal conductivity: 50 W/mK (anisotropic)
  • Extraordinary chemical resistance and longterm stability
  • Shock absorbing

DISPONIBILITÉ

  • Sheet 140 x 140 mm
    (TEL-ZXXXX-SI)
  • Die cut parts
  • Optional with adhesive stripes or dots
    (TEL-ZXXXX-SI-A1)

EXEMPLES D'APPLICATION

Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems

OVERVIEW

PropertyUnitTEL-Z0200-SITEL-Z0500-SITEL-Z1000-SI
MaterialGrafit gefülltes SilikonelastomerGrafit gefülltes SilikonelastomerGrafit gefülltes Silikonelastomer
ColourBlackBlackBlack
Thicknessmm0,2±0,050,5±0,051,0±0,10
HardnessShore 00757575
UL FlammabilityUL 94V0V0V0
RoHS Conformity2015 / 863 / EUYesYesYes
Thermal
Resistance1 @ 90 PSI Thickness°C-inch²/W (mm)0,020 (0,16)0,060 (0,33)0,09 (0,70)
Resistance1 @ 30 PSI @ Thickness°C-inch²/W (mm)0,027 (0,18)0,075 (0,48)0,11 (0,91)
Resistance1 @ 10 PSI @ Thickness°C-inch²/W (mm)0,050 (0,19)0,095 (0,49)0,13 (0,97)
Thermal ConductivityW/mK505050
Operating Temperature Range°C- 50 bis + 180- 50 bis + 180- 50 bis + 180
Electric
Volume ResistivityOhm - cm< 50.000< 50.000< 50.000