TDG-W-SI-2C
CONTACT Téléchargements TDG-W-SI-2C Data Sheet Commande d’échantillonnageTDG-W-SI-2C is a 2-part dispensable low volatile silicone gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact. Due to its negligible and controlled volatile content it is suited for environments where volatile silicones and paint wetting impairment are critical.
PROPRIÉTÉS
- Dispensable 2-part silicone
- Low volatile siloxane content (LV)
- No paint wetting impairment
- Thermal conductivity: 4.5 W/mK
- Remains elastic after polymerisation
- Zero stress on components
- Heat accelerated curing
- Shock absorbing
DISPONIBILITÉ
- Cartridges 2 x 25 ml / 2 x 100 ml /
2 x 200 ml / 2 x 600 ml - Pail 2 x 25 kg
- On request
EXEMPLES D'APPLICATION
Thermal link of:
- FPBGA
- Capacitors
- Heat Pipes
- BGA
For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs
OVERVIEW
Property | Unit | A-Komponente | B-Komponente |
---|---|---|---|
Material | Silikon | Silikon | |
Colour | Pink | Weiss | |
Dichte @ 25 °C (gemischt) | g/cm³ | 3.15 | 3.15 |
Mischungsverhältnis | Gew. oder Vol. | 1 : 1 | 1 : 1 |
Hardness | Shore 00 | 55 | 55 |
Viskosität (Brookfield @ 10 rpm, 25 °C) | Pas | 250 | 250 |
Viskosität (gemischt (Brookfield @ 10 rpm, 25 °C)) | Pas | 250 | 250 |
Topfzeit @ 25 °C und 65 % RH | Minuten | > 120 | > 120 |
Curing Time @ 25 °C / 100 °C (Time for viscosity to double) | < 24 h / 15–30 min | < 24 h / 15–30 min | |
Shelf Life (from Date of Manufacturing, unopened, @ < 35 °C) | Months | 6 | 6 |
No Paint Wetting Impairment Substances (PWIS)1 | Passed | Passed | |
UL Flammability | UL 94 | V0 (≥ 0.15 mm) | V0 (≥ 0.15 mm) |
RoHS Conformity | 2015 / 863 / EU | Yes | Yes |
Technisch | |||
Wärmeleitfähigkeit2 | W/mK | 4.5 | 4.5 |
Operating Temperature Range | °C | - 40 bis + 150 | - 40 bis + 150 |
Dielectric Strength | kV/mm | > 10 | > 10 |
Volume Resistivity | Ohm-cm | > 1 x 1010 | > 1 x 1010 |