TDG-Z8-SI-2C

TDG-Z8-SI-2C is a 2-part dispensable silicone gap filler which is filled with thermally conductive
fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-
coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place.

It has a natural low level tack that enhances a good thermal contact.

PROPRIÉTÉS
  • Dispensable 2-part silicone
  • Thermal conductivity: 8.0 W/mK
  • Remains elastic after polymerisation
  • Zero stress on components
  • Heat accelerated curing
  • Shock absorbing
DISPONIBILITÉ
  • Cartridges 2 x 25 ml / 2 x 200 ml / 2 x 600 ml
  • Pail 2 x 25 kg
EXEMPLES D'APPLICATION

Thermal link of:

  • FPBGA
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs

OVERVIEW
PropertyUnitA-KomponenteB-Komponente
ColourBlueWhite
Density @ 25 °Cg/cm³3,253,25
Mixing RatioWeight or Volume1 : 11 : 1
HardnessShore 006565
ViscosityPas200180
Viscosity (mixed)Pas190190
Pot Life @ 25 °C and 65 % RH (Time for viscosity to double)Minutes40 – 9040 – 90
Curing Time @ 25 °C / 80 °CHours / Minutes10 ±2 / 30 ±1010 ±2 / 30 ±10
Shelf Life (from Date of Manu- facturing, unopened, dry storage conditions @ –15 – 35 °C) Months99
Flammability (Equivalent)UL 94V0V0
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal ConductivityW/mK88
Operating Temperature°C- 40 bis + 150- 40 bis + 150
Dielectric StrengthkV/mm≥ 8≥ 8
Volume ResistivityOhm-cm≥ 1 x 1012≥ 1 x 1012

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