TDG-Z11-SI-2C

Produktbild TDG-Zx-SI-2C-LV

TDG-Z11-SI-2C is a 2-part dispensable  silicone gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact.

PROPRIÉTÉS
  • Dispensable 2-part silicone
  • Thermal conductivity: 11,0 W/mK
  • Remains elastic after polymerisation
  • Zero stress on components
  • Heat accelerated curing
  • Shock absorbing
DISPONIBILITÉ
  • Cartridges 2 x 25 ml / 2 x 200 ml / 2 x 600 ml
  • Pail 2 x 25 kg
EXEMPLES D'APPLICATION

Thermal link of:

  • FPBGA
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs

OVERVIEW
PropertyUnitA-KomponenteB-Komponente
ColourGreenish GreyGrey
Density @ 25 °Cg/cm³3,303,30
Mixing RatioGew. oder Vol.1 : 11 : 1
Hardness Shore 005050
ViscosityPas220200
Viscosity (mixed)Pas210210
Pot Life @ 25 °C and 65 % RH (Time for viscosity to double)Minuten40 – 9040 – 90
Curing Time @ 25 °C / 80 °CStunden / Minuten10 ±2 / ≥ 3010 ±2 / ≥ 30
Shelf Life (from Date of Manu- facturing, unopened, dry storage conditions @ –15 – 35 °C) Months99
Flammability (Equivalent)UL 94V0V0
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal ConductivityW/mK1111
Operating Temperature°C- 40 bis + 150- 40 bis + 150
Dielectric StrengthkV/mm≥ 7≥ 7
Volume ResistivityOhm-cm≥ 1 x 1012≥ 1 x 1012

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