TFO-M-SI-PI
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Commande d’échantillonnage
TFO-M-SI-PI is an electrically insulating thermally conductive foil made of a high voltage resistant Polyimide film with thermally conductive silicone coating on both sides for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a very high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The material is characterised by its very high dielectric properties. The substrate film provides for an outstanding mechanic stability and cutthrough resistance as well as easy handling.
PROPRIÉTÉS
- High thermal contact
- Very high dielectric strength
- Outstanding mechanic stability through substrate film
- Extraordinary chemical resistance and longterm stability
- Residue-free removal after use
DISPONIBILITÉ
- Sheet 320 x 400 mm
Others on request - Roll 320 mm x 50 m
- Non tacky
(TFO-MXXX-SI-PI) - Die cut parts
EXEMPLES D'APPLICATION
Thermal link of:
- MOSFETs or IGBTs
- Power diodes or AC/DC converters
- Power modules
For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems
OVERVIEW
| Property | Unit | TFO-M110-SI-PI | TFO-M150-SI-PI |
|---|---|---|---|
| Material | Mit Keramik gefüllter silikonbeschichteter Isolationsfilm | Mit Keramik gefüllter silikonbeschichteter Isolationsfilm | |
| Colour | Hellbraun | Hellbraun | |
| Reinforcement | Polyimid Isolationsfilm | Polyimid Isolationsfilm | |
| Thickness | mm | 0,11±0,02 | 0,15±0,02 |
| UL Flammability | UL 94 | V0 | VO |
| RoHS Conformity | 2015 / 863 / EU | Yes | Yes |
| Thermal | |||
| Resistances1 @ 150 PSI | °C-inch²/W | 0,29 | 0,40 |
| Resistances1 @ 30 PSI | °C-inch²/W | 0,55 | 0,75 |
| Operating Temperature Range | °C | - 40 bis + 180 | - 40 bis + 180 |
| Electric | |||
| Breakdown Voltage2 | kV AC | 6 | > 6 |
