TFO-K-SI
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Commande d’échantillonnage
TFO-K-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a very high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low tack pressure sensitive adhesive on one side.
PROPRIÉTÉS
- Thermal conductivity: 2.5 W/mK
- High thermal contact
- Outstanding mechanic stability through fibreglass reinforcement
- Extraordinary chemical resistance and longterm stability
- Residue-free removal after use
DISPONIBILITÉ
- Sheet 320 x 1000 mm
- Roll 320 mm x 50 m
- Non tacky
(TFO-K200-SI) - Tacky on one side
(TFO-K200-SI-A1) - Die cut parts
- Kiss cut parts on roll
- Kiss cut parts on sheet
EXEMPLES D'APPLICATION
Thermal link of:
- MOSFETs or IGBTs
- Power diodes or AC/DC converters
- Power modules
For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems
OVERVIEW
| Property | Unit | TFO-K200-SI |
|---|---|---|
| Material | Ceramic filled silicone | |
| Colour | Grey | |
| Reinforcement | Fibreglass | |
| Thickness | mm | 0,23±0,05 |
| Tensile Strength1 | MPa | 20 |
| UL Flammability | UL 94 | VO |
| RoHS Conformity | 2015 / 863 / EU | Yes |
| Thermal | ||
| Resistances2 @ 150 PSI | °C-inch²/W | 0,24 |
| Resistance2 @ 30 PSI | °C-inch²/W | 0,47 |
| Thermal Conductivity | W/mK | 2,5 |
| Operating Temperature Range | °C | - 50 bis + 200 |
| Electric | ||
| Breakdown Voltage3 | kV AC | 2,0 |
| Volume Resistivity | Ohm - cm | 2,0 x 1014 |
| Dielectric Constant | @ 1 MHz | 4,0 |
