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TFO-T-SI Silikonfolie glasfaserverstärkt

TFO-T-SI is a high performance electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with highly thermally conductive ceramic particles a very high thermal conductivity is reached. Its conformal surface structure guarantees a very good compliance to the contact surfaces. Thus the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cutthrough resistance as well as easy handling. For an easy and reliable preassembly the interface material is available with low tack pressure sensitive adhesive on one side.


  • Thermal conductivity: 4.1 W/mK
  • High surface compliance
  • Excellent thermal contact
  • Outstanding mechanic stability through fibreglass reinforcement
  • Extraordinary chemical resistance and longterm stability
  • Residue-free removal after use


  • Sheet 440 x 510 mm
  • Non tacky
  • Tacky on one side
  • Die cut parts
  • Kiss cut parts on sheet


Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems


MaterialCeramic filled siliconeCeramic filled siliconeCeramic filled siliconeCeramic filled silicone
Thicknessmm0,20±0,050,30±0,050,45±0,050,80+0,20 / -0,05
Tensile Strength1MPa2520149
UL FlammabilityUL 94VOVOVOVO
RoHS Conformity2015 / 863 / EUYesYesYesYes
Resistances2 @ 150 PSI°C-inch²/W0,160,210,240,36
Resistance2 @ 30 PSI°C-inch²/W0,390,470,530,74
Thermal ConductivityW/mK4,14,14,14,1
Operating Temperature Range°C- 50 bis + 200- 50 bis + 200- 50 bis + 200- 50 bis + 200
Breakdown Voltage3kV AC3,06,59,0> 10
Volume ResistivityOhm - cm1,9 x 10152,4 x 10153,3 x 10154,1 x 1015
Dielectric Constant@ 1 MHz3,63,63,63,6