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TFO-K-SI Silikonfolie glasfaserverstärkt

TFO-O-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a very high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The material is characterised by its very high dielectric properties. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low tack pressure sensitive adhesive on one side.


  • Thermal conductivity: 3.0 W/mK
  • High thermal contact
  • Outstanding mechanic stability through fibreglass reinforcement
  • Very high dielectric strength
  • Extraordinary chemical resistance and longterm stability
  • Residue-free removal after use


  • Sheet
  • Roll 300 mm x 50 m (0.20 / 0.30 mm)
  • Roll 300 mm x 25 m (0.45 mm)
  • Non tacky
  • Tacky on one side
  • Die cut parts
  • Kiss cut parts on roll
  • Kiss cut parts on sheet


Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / High voltage hybrid automotive applications / PS units / Solar systems


MaterialCeramic filled siliconeCeramic filled siliconeCeramic filled silicone
Tensile Strength1kpsi3.32.31.6
UL FlammabilityUL 94V0V0V0
RoHS Conformity2015 / 863 / EUYesYesYes
Resistances2 @ 150 PSI°C-inch²/W0,220,300,38
Resistance2 @ 30 PSI°C-inch²/W0,550,600,70
Thermal ConductivityW/mK3,03,03,0
Operating Temperature Range°C- 40 bis + 180- 40 bis + 180- 40 bis + 180
Breakdown Voltage3kV AC5.07.08.0
Volume ResistivityOhm - cm9.2 x 10138.8 x 10133,4 x 1012
Dielectric Constant@ 1 MHz4.85.66.2