TPC-X-PC-NC-HT-M/-E

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TGR-M-NS Silikonfreie Wärmeleitpaste hoch thermisch leitfähig

TPC-X-PC-NC-HT-M/-E is a thixotropic thermally conductive phase changing compound optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change compound starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at very low pressure. Both thin bondline and high thermal conductivity minimise the total thermal resistance. It can be pre-applied by screen printing. After drying the compound is dry-to-the-touch and ready for use on the thermal contact area. The compound is designed for applications with extended temperature requirements.
TPC-X-PC-NC-HT-M and TPC-X-PC-NC-HT-E are printable compounds with alternatively long and extended dry times. TPC-X-PC-NC-HT-E dries only at elevated temperature.



PROPRIÉTÉS

  • Optimal thermal contact by thin bondline
  • Silicone-free
  • Thermal conductivity: 3.0 W/mK
  • Dielectric
  • Thixotropic
  • Ideal alternative and replacement of messy thermal grease
  • Accurate automated application by stencil printing for mass production
  • TPC-X-PC-NC-HT-M
    med dry time: @ RT or elevated temp.
  • TPC-X-PC-NC-HT-E
    extended dry time: only @ elevated temp.

DISPONIBILITÉ

  • TPC-X-PC-NC-HT-M and TPC-X-PC-NC-HT-E:
    Printable type med dry -M and extended dry -E
  • -E dries at elevated temperature only
  • 360 ml SEMCO cartridges (transparent)
  • 30 ml syringes

EXEMPLES D'APPLICATION

Thermal link of

  • MOSFETs and IGBTs
  • Memory Modules
  • IGBT Power Modules
  • CPUs

For use in Servo drive control units / Computers / Automation appliances / Microelectronics

OVERVIEW

PropertyUnitTPC-X-PC-NC-HT-MTPC-X-PC-NC-HT-E
MaterialDryable Phase-Change CompoundDryable Phase-Change Compound
ColourWhiteWhite
Prozess~ Print~ Print
Specific Gravity dried
Specific Gravity undried		g/cm³
g/cm³		1,1 @ RT
1,0 @ RT		1,10 @ RT
1,05 @ RT
Viscosity dried @ 10 rpm
Viscosity undried @ 10 rpm 		Pas
Pas		65 @ 60°C / 38 @ 80°C / 25 @ 100°C / 18 @ 120°C
85 @ RT		65 @ 60°C / 38 @ 80°C / 25 @ 100°C / 18 @ 120°C
96 @ RT
Drying @ Temperature @ ThicknessZeit@ 22°C: 24 h (0,05 mm) 48 h (0,15 mm) 56 h (0,25 mm)
@ 60°C: 24 min (0,05 mm) 53 min (0,15 mm) 56 min (0,25 mm)
@ 125°C: 4 min (0,05 mm) 6 min (0,15 mm) 10 min (0,25 mm) 		@ 60°C: 4 h (0,05 mm) 12 h (0,15 mm) 20 h (0,25mm
@ 125°C: 10 min (0,05 mm) 15 min (0,15 mm) 20 min (0,25 mm)
Storage (@ RT)Months99
RoHS Conformity2015/863/EUYesYes
Thermal
Resistances1 @ 150 PSI°C-inch²/W0,020,02
Resistances1 @ 30 PSI°C-inch²/W0,030,03
Resistance2 @ 10 PSI @ Thickness°C-inch²/W0,040,04
Thermal ConductivityW/mK3,03,0
Phase Change Temperatur°Cca. 45ca. 45
Operating Temperature Range°C< 140< 140
Max. Storage Temperature°C2525