TPC-W-PC

TPC-W-PC is thermally conductive phase changing film optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change compound starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at very low pressure. The particular formulation and the thixotropic nature prevents from run-out as well as migration. The material is available as TPC-W-PC as free standing film or with different substrates thus reworkability is improved since no compound residues remain on one side.
- Optimal thermal contact
- Thermal conductivity: 3.5 W/mK
- Silicone-free
- No migrating, pump-out or run out due to thixotropic properties
- Ideal alternative and replacement of messy thermal grease
- Different optional substrates allow for one-side residue-freeness and improved reworkability
- Sheet 356 x 305 mm
- Roll 356 mm (Liner 394 mm ) x L
(up to 150 m) - TPC-WXXX-PC: Die cut parts
between 2 release liners - One-side coated substrates:
Aluminum TPC-WXXX-PC-ALYYY
Copper TPC-WXXX-PC-CUYYY
Thermal link of:
- MOSFETs or IGBTs
- Memory modules
- Power modules
- CPUs
For use in Servo drive control units / Computers / Automation appliances / Microelectronics
Property | Unit | TPC-W100-PC | TPC-W200-PC | TPC-300-PC |
---|---|---|---|---|
Material | Phase Change Film | Phase Change Film | Phase Change Film | |
Colour | Grey | Grey | Grey | |
Total Thickness | mm | 0,1+0,12 / -0,08 | 0,2+0,23 / -0,17 | 0,3+0,33 / -0,27 |
Density | g/cm³ | 2,0 | 2,0 | 2,0 |
RoHS Conformity | 2015 / 863 / EU | Yes | Yes | Yes |
Thermal | ||||
Resistances1 @ 150 PSI | °C-inch²/W | 0,0056 | 0,0061 | 0,0067 |
Resistances1 @ 30 PSI | °C-inch²/W | 0,0097 | 0,0103 | 0,0111 |
Resistance2 @ 10 PSI @ Thickness | °C-inch²/W | 0,0138 | 0,0148 | 0,0158 |
Thermal Conductivity | W/mK | 3,5 | 3,5 | 3,5 |
Phase Change Temperatur | °C | ca. 45 | ca. 45 | ca. 45 |
Storage | Months | 24 | 24 | 24 |
Max. Storage Temperature | °C | 27 | 27 | 27 |