PRODUCT OF THE MONTH – JULY 2026
When high power dissipation meets complex geometries and wide tolerances, traditional thermal pads aren’t always the best solution. That’s exactly where our TDG-Z10-SI-2C is a game changer. This dispensable, silicone-based two-component gap filler combines high thermal conductivity of 10.0 W/mK with excellent conformability. Thanks to its thixotropic behavior, the material can be applied precisely and cures directly at the desired position. This ensures reliable thermal contact even on non-planar surfaces or with large gap dimensions.
Another particularly interesting feature: After curing, TDG-Z10-SI-2C remains elastic, dampens vibrations, and reduces mechanical stress on sensitive components. At the same time, the minimized siloxane content ensures suitability for use in sensitive environments where volatile silicones can be problematic. This makes the silicone gap filler ideal for challenging applications in automotive, 5G, and telecommunications technology, industrial computers, notebooks, or medical technology. Whether for the thermal bonding of BGA components, inductors, capacitors, or heat pipes—the TDG-Z10-SI-2C supports reliable thermal management when performance, efficiency, and longevity are required.
Looking for a customized solution for your thermal management needs? Our experts are happy to assist you in selecting materials and designing your application just call +49 7021 73141 79
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