Even at low pressure, optimum thermal contact can be achieved with our TGF-TSS-SI gap filler pads. In addition, the material impresses with its extreme resistance to aging as well as chemical resistance and reliability 💪. Thanks to its natural tackiness, the material can also be pre-applied for easy assembly. These properties are in demand, for example, in applications such as
• diagnose laptops,
• medical devices,
• embedded PCB boards,
• automotive applications
Is this the optimal Thermal Management solution for your application?
Call us to establish that! 😉 📞 ⬇️
+49 89 665 477 83