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PRODUCT OF THE MONTH – NOVEMBER 2026


Volatile siloxanes released by silicone elastomers can be a critical issue in sensitive electronic, optical and automotive applications. Our TGF-NSS-NS silicone-free gap filler pad bridges large gaps and component height differences while ensuring efficient heat transfer and reliable thermal contact – even at very low pressure.

  • Silicone-free acrylic – no volatile siloxanes
  • Thermal conductivity 2.5 W/mK, electrically insulating
  • Extremely soft & conformable at very low pressure
  • Vibration-damping and naturally tacky for easy pre-assembly

The ceramic-filled acrylic elastomer adapts to uneven surfaces and component tolerances, minimizing total thermal interface resistance. Rated UL 94 V-0 and RoHS compliant, the thermal pad is ideal for SMD components, RDRAM memory, through-hole vias and heat pipe connections in automotive electronics, notebooks, medical technology and industrial computers. Available tacky on both sides, with a transparent film for single-sided tack, as die-cut parts or as kiss-cut parts on sheets.

Discover how HALA thermal interface materials help engineers optimize heat dissipation and improve system performance. Looking for a silicone-free thermal interface material for silicone-sensitive applications? Let’s discuss how TGF-NSS-NS can support your next thermal management project.

+49 7021 73141 79

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Explore TGF-NSS-NS

Product of the Month November 2026: TGF-NSS-NS, Silicone-Free Gap-Filler, Thermal conductivity: 2.5 W/mK, Operation temperature range: -40 to +125°C, Standard thicknesses: 0.5 mm up to 4.0 mm

Product of the Month November 2026: TGF-NSS-NS, Silicone-Free Gap-Filler

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