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In today’s cutting-edge electronic devices – whether laptops or medicalequipment – uneven gaps caused by varying component heights are a common challenge. Our TGF-VUS-SI-A1 low volatile siloxane gapfiller is the perfect solution: with a thermal conductivity of 5.0 W/mK and exceptional softness, it ensures optimal heat transfer with minimal pressure.
Its natural tackiness on one and non-tackiness on the other side allows for easy pre-application while minimizing thermal resistance. Plus, it’s highly durable, chemically resistant, and vibration-dampening, making it ideal for automotive applications such as battery chargers, SMD components, or 5 G server applications and switches.
Ready to take your thermal management to the next level?
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