For applications requiring low contact forces, large gap dimensions, or vibration-damping properties, we offer TGF-GXS-SI-A1 as a highly effective and cost efficient solution. Our ultra-soft silicone-based gap filler is equipped with ceramic fillers. This ensures reliable heat dissipation while providing high electrical insulation.

As a thermally conductive interface material, TGF-GXS-SI-A1 supports reliable and long-lasting thermalmanagement – even under difficult conditions. With a thermal conductivity of 1.5 W/mK, minimized volatile siloxane content (< 100 ppm), and excellent conformability, TGF-GXS-SI-A1 is particularly suitable for sensitive applications— in the automotiveindustry, medicaltechnology, industrialelectronics, or mobiledevices, for example. Another advantage: Even with minimal pressure, effective thermal contact is established – which is particularly important for mechanically sensitive components.

Typical application scenarios include the thermal connection of SMD parts, through-hole vias, capacitors, or heat pipes. The one-sided tackiness of the thermally conductive film due to the thin layer (-A1) enables a non-tacky side and simple pre-assembly on the other tacky side. – as a mat, die-cut part, or kiss-cut on a sheet.

Are you looking for a thermal solution that is soft, reliable, and process-oriented? Then TGF-GXS-SI-A1 is the ideal option.

Talk to us about your application or request samples:
+49 7021 73141 79

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