PROPRIÉTÉS
- Fixing by M4-screw
- FE-simulation optimised stress behaviour
- Mounting friendly design
- Sufficient pressure even at minimum package height (ca. 4.7 mm for TO 247)
- Anticorrosive by Delta Seal surface treament
- Easy chip identification by apertures
Espace de travail
- Force range: ca. 95…110 N
- Pressure range:
ca. 28…32 N/cm² (40…47 PSI)
for different types of TO 247
packages (Surface area
TO 247 ca. 3.4 cm²)
EXEMPLES D'APPLICATION
Fixing of semiconductors in TO 247 or comparable packages onto heatsinks:
- MOSFETs
- IGBTs
- Diodes
For use in switch mode power supplies / UPS units / Motor control units / Automotive applications
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