PRODUCT OF THE MONTH – APRIL 2026
Especially with sensitive components and large tolerances, the choice of the right material is crucial for efficient thermal management.
TGF-VUS-SI–A1 is our electrically insulating, thermally conductive silicone gap filler, which is particularly well suited for applications with large gap dimensions and sensitive components. Thanks to its exceptional softness, the material adapts perfectly to uneven surfaces and ensures reliable thermal contact even at very low contact pressure.
With a thermal conductivity of 5.0 W/mK and reduced siloxane content, TGF-VUS-SI–A1 is ideal for sensitive electronic assemblies. At the same time, the material dampens vibrations and is easy to pre-apply thanks to its natural adhesive properties.
TGF-VUS-SI–A1 has proven itself in SMD components, BGAs, memory modules, and flip chips in applications such as automotive electronics, notebooks, medical technology, and embedded systems. In other words, wherever reliable heat dissipation is crucial for performance and service life.
Questions about application or the right material? Our team will be happy to advise you personally: +49 7021 73141 79
